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mpx2053 rev 9, 10/2012 freescale semiconductor data sheet: technical data ? 2005-2009, 2012 freescale semiconductor inc. all rights reserved. pressure 50 kpa on-chip temperature compensated and calibrated silicon pressure sensors the mpx2053 series devices are silicon piezoresistive pressure sensors that provide a highly accurate and linear voltage output directly proportional to the applied pressure. a single, monolithic silicon diaphragm with the strain gauge and an integrated thin-film resistor network. precise span and offset calibration with temperature compensation are achieved by laser trimming. features ? temperature compensated over 0 ? c to +85 ?c ? easy-to-use chip carrier package options ? ratiometric to supply voltage ? gauge ported and non ported options ? available in easy-to-use tape & reel ? differential and gauge pressure options ordering information device name case no. # of ports pressure type device marking none single dual gauge differential absolute small outline package (mpxv2053g series) mpxv2053gp 1369 ? ? mpxv2053gp MPXV2053DP 1351 ? ? MPXV2053DP unibody package (mpx2053 series) mpx2053d 344 ? ? mpx2053d mpx2053dp 344c ? ? mpx2053dp mpx2053gp 344b ? ? mpx2053gp mpak package (mpxm2053 series) mpxm2053d 1320 ? ? mpxm2053d mpxm2053dt1 1320 ? ? mpxm2053d mpxm2053gs 1320a ? ? mpxm2053gs mpxm2053gst1 1320a ? ? mpxm2053gs mpx2053 series 0 to 50 kpa (0 to 7.25 psi) 40 mv full scale (typical) application examples ? pump/motor control ? robotics ? level detectors ? medical diagnostics ? pressure switching ? blood pressure measurement
mpx2053 sensors freescale semiconductor, inc. 2 pressure small outline packages mpxv2053gp case 1369-01 MPXV2053DP case 1351-01 mpxm2053d/dt1 case 1320-02 mpxm2053gs/gst1 case 1320a-02 mpak packages unibody packages mpx2053d case 344-15 mpx2053gp case 344b-01 mpx2053dp case 344c-01
mpx2053 sensors 3 freescale semiconductor, inc. pressure operating characteristics maximum ratings table 1. operating characteristics (v s = 10 v dc , t a = 25c unless otherwise noted, p1 > p2) characteristic symbol min typ max units pressure range (1) 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op 0 ? 50 kpa supply voltage (2) 2. device is ratiometric within this specified excitation range. operating the device above the specified excitation range may i nduce additional error due to device self-heating. v s ? 10 16 v dc supply current i o ? 6.0 ? madc full scale span (3) 3. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. v fs 38.5 40 41.5 mv offset (4) 4. offset (v off ) is defined as the output voltage at the minimum rated pressure. ? ?1.0 ? 1.0 mv sensitivity ? ? v/ ? p? 0.8 ? non-linearity ? ?0.6 ? 0.4 %v fs pressure hysteresis (0 to 50 kpa) ? ? ? 0.1 ? %v fs temperature hysteresis (-40 to 125c) ? ? ? 0.5 ? %v fs temperature coefficient of full scale tcv fs ?2.0 ? 2.0 %v fs temperature coefficient of offset tcv off ?1.0 ? 1.0 mv input impedance z in 1000 ? 2500 ? output impedance z out 1400 ? 3000 ? response time (5) (10% to 90%) 5. response time is defined as the time for the incremental c hange in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ? 1.0 ? ms warm-up time ? ? 20 ? ms offset stability (6) 6. offset stability is the product's output deviation when subjected to 1000 hours of pu lsed pressure, temperature cycling with bias test. ? ? ? 0.5 ? %v fs table 2. maximum ratings (1) rating max value unit supply voltage 16 v pressure (p1 > p2) 200 kpa storage temperature ?40 to +125 ? c operating temperature range ?40 to +125 ? c 1. exposure beyond the specified limits may c ause permanent damage or degradation to the device.
mpx2053 sensors freescale semiconductor, inc. 4 pressure figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. figure 1. temperature compensated pressure sensor schematic voltage output versus appl ied differential pressure the differential voltage output of the sensor is directly proportional to the differential pressure applied. the output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side relative to the vacuum side. similarly, output voltage increases as increasing vacuum is applied to the vacuum side relative to th e pressure side. on-chip temperature compensation and calibration figure 2 shows the minimum, maxi mum and typical output characteristics of the mpx2053 series at 25 ? c. the output is directly proportional to the differential pressure and is essentially a straight line. a silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. figure 2. output vs. pressure differential v s 3 x-ducer sensing element thin film temperature compensation and calibration 2 4 v out+ v out- 1 gnd output (mvdc) kpa psi 40 35 30 25 15 10 5 0 -5 0 12.5 1.8 25 3.6 37.5 5.4 50 7.25 20 max typ min offset (typ) span range (typ) v s = 10 vdc t a = 25 ? c
mpx2053 sensors 5 freescale semiconductor, inc. pressure linearity linearity refers to how well a transducer's output follows the equation: v out = v off + sensitivity x p over the operating pressure range. there are two basic methods for calculating nonlinearity: (1) end point straight line fit (see figure 3 ) or (2) a least squares best line fit. while a least squares fit gives the ?best case? linearity error (lower numerical value), the calculations required are burdensome. conversely, an end point fit will give the ?worst case? error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. the specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. figure 3. linearity specification comparison figure 4 illustrates the differenti al or gauge configuration in the basic chip carrier (case 344). a silicone gel isolates the die surface and wire bonds fr om the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. the mpx2053 series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. media other than dry air may have adverse effects on sensor performance and long term reliability. contact the factory for information regarding media compatibility in your application. refer to application note an3728, for more information regarding media compatibility. figure 4. unibody package ? cross-sectional diagram (not to scale) relative voltage output pressure (% full scale) 0 50 100 end point straight line fit exaggerated performance least squares fit straight line offset least square deviation silicone die coat die p1 p2 wire bond lead frame rtv die bond epoxy case stainless steel metal cover
mpx2053 sensors 6 freescale semiconductor, inc. notes: 1. 2. 3. dimensioning and tolerancing per asme y14.5m, 1994. controlling dimension: inch. dimension -a- is inclusive of the mold stop ring. mold stop ring not to exceed 16.00 (0.630). m a m 0.136 (0.005) t 1234 pin 1 r n l g f d 4 pl seating plane -t- c m j b -a- dambar trim zone: f this is included within dim. "f" 8 pl 1 23 4 y z style 1: pin 1. ground 2. + output 3. + supply 4. - output style 2: pin 1. v cc 2. - supply 3. + supply 4. ground style 3: pin 1. gnd 2. -vout 3. vs 4. +vout dim min max min max millimeters inches a 0.595 0.630 15.11 16.00 b 0.514 0.534 13.06 13.56 c 0.200 0.220 5.08 5.59 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.40 l 0.695 0.725 17.65 18.42 m 30? nom 30? nom n 0.475 0.495 12.07 12.57 r 0.430 0.450 10.92 11.43 y 0.048 0.052 1.22 1.32 z 0.106 0.118 2.68 3.00 case 344-15 issue aa unibody package notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. d 4 pl f u h l port #1 positive pressure (p1) pin 1 -a- -q- s k g -p- s q m 0.25 (0.010) t s s m 0.13 (0.005) q s t 12 34 seating plane b n r c j -t- style 1: pin 1. ground 2. + output 3. + supply 4. - output dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.305 0.325 7.75 8.26 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc h 0.182 0.194 4.62 4.93 j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.230 0.250 5.84 6.35 s u 0.910 bsc 23.11 bsc 0.220 0.240 5.59 6.10 case 344b-01 issue b unibody package package dimensions
mpx2053 sensors freescale semiconductor, inc. 7 package dimensions notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. port #2 port #1 port #2 vacuum (p2) (p1) seating plane seating plane k s w h l u f g d 4 pl port #1 positive pressure -q- 12 4 3 pin 1 -p- -t- -t- s q m 0.25 (0.010) t s s m 0.13 (0.005) q s t b n j c v r -a- style 1: pin 1. ground 2. + output 3. + supply 4. - output dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.405 0.435 10.29 11.05 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc h 0.182 0.194 4.62 4.93 j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.063 0.083 1.60 2.11 s u 0.910 bsc 23.11 bsc v 0.248 0.278 6.30 7.06 w 0.310 0.330 7.87 8.38 0.220 0.240 5.59 6.10 case 344c-01 issue b unibody package
mpx2053 sensors freescale semiconductor, inc. 8 case 1351-01 issue a small outline package page 1 of 2 package dimensions
mpx2053 sensors 9 freescale semiconductor, inc. case 1351-01 issue a small outline package page 2 of 2 package dimensions
mpx2053 sensors freescale semiconductor, inc. 10 case 1369-01 issue d small outline package package dimensions page 1 of 2
mpx2053 sensors freescale semiconductor, inc. 11 package dimensions page 2 of 2 case 1369-01 issue d small outline package
mpx2053 sensors freescale semiconductor, inc. 12 package dimensions case 1320-02 issue b page 1 of 2
mpx2053 sensors freescale semiconductor, inc. 13 package dimensions case 1320-02 issue b page 2 of 2
mpx2053 sensors freescale semiconductor, inc. 14 pressure package dimensions case 1320a-02 issue a pin 4 pin 1 page 1 of 2
mpx2053 sensors 15 freescale semiconductor, inc. pressure package dimensions case 1320a-02 issue a page 2 of 2
mpx2053 sensors freescale semiconductor, inc. 16 pressure table 3. revision history revision number revision date description of changes 9 10/2012 ? deleted references to device number mpxv2053gvp throughout the document
mpx2053 rev. 9 10/2012 how to reach us: home page: freescale.com web support: freescale.com/support information in this document is provided solely to enable system and software implementers to use freescale products. there are no express or implied copyright licenses granted hereunder to design or fabr icate any integrated circuits based on the information in this document. freescale reserves the right to make changes without further notice to any products herein. freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. all operating parameters, including ?typicals,? must be validated for each customer application by customer?s technical experts. freescale does not convey any license under its patent rights nor the rights of others. freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. freescale, the freescale logo, energy efficient solutions logo, are trademarks of freescale semiconductor, inc., reg. u.s. pat. & tm. off. xtrinsic is a trademark of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? 2012 freescale semiconductor, inc.

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